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 Palacios Group

Using Intellectual Expertise to Resolve Real World Problems

We work towards a vision to globally impact the world of power electronics, heterogeneous devices, Graphene-based 2D and 3D materials, and Gallium Nitride lateral and vertical devices. Meet our group that makes it possible. Scroll down to learn more about their work. We also acknowledge the many brilliant minds we had the opportunity to work with over many years, that have helped shape us into the group that we are today. Click here to meet and learn more about our alumni group. Click here to learn more about our group's outreach efforts.

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Srikrishna Chakravarthi

Research Assistant, EECS

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Ashley Goodnight

Research Assistant, EECS

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Joshua Park

Research Assistant, EECS

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Cheng-Hsing Liu

Research Assistant, EECS

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Patrick Darmawi-Iskandar

Research Assistant, EECS 

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Aditya Varma

Research Assistant, EECS

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Jung-Han (Sharon) Hsia

Research Assistant, EECS

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Dr. Zhongyunshen (Michael) Zhu

Post Doctoral Scholar, EECS

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Hridibrata Pal

Research Assistant, EECS

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Gillian Micale

Research Assistant, DMSE

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Yixuan Jiao

Research Assistant, EECS

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Aijia Yao

Research Assistant, EECS

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Pradyot Yadav

Research Assistant, EECS 

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Hae Won Lee

Research Assistant, EECS

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Deniz I Erus

Research Assistant, EECS

Welcome!!!

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Ayush Gupta

Research Assistant, EECS

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Christian Lopez

Research Assistant, EECS

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Minsik Oh

Research Assistant, EECS

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Rachel (Can) Jiang

SUPER UROP, EECS

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Dr. Jiadi Zhu

CEO, CDimensions

Recent Graduate, Congratulations!! 

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Dr. John Niroula

Recent Graduate, Congratulations!! 

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Dr. Josh Perozek

CTO, Vertical Horizons 

Recent Graduate, Congratulations!! 

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Kevin Limanta

Recent Under Graduate! Enrolled in Dartmouth College

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Soojung Bae

UROP, EECS

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Jeewoo Kang

UROP, EECS

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Dr. Ana Cremades

Visiting Scientist, UCM, Spain

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Preetha Kingsview,

MAED, MS.C.S Assistant to Prof. Palacios, Group Administrator, Palacios Group, MIT

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Tomás Palacios

Director, Microsystems Technology Laboratories (MTL)Clarence J. LeBel Professor,Electrical Engineering, MIT 

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